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SHUTTLE Barebone DA320 Black

Forsiden Computere Stationære PC SHUTTLE Barebone DA320 Black
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SHUTTLE Barebone DA320 Black (DA320)

SHUTTLE Barebone DA320 Black

Varenr.:
DA320
  • Form Factor Mini PC
  • Processor Ingen CPU
  • Antal processorer 1
  • Diskret grafik Ikke tilgængelig
  • HDD 0GB
  • SSD / Flash 0GB
  • Memory 0GB
  • OS FreeDOS
  • Model Shuttle XPC Slim
  • CTO / BTO Nej
Beskrivelse

XPC slim DA320


Space-saving Barebone for AMD Ryzen processors

With this flat Mini-PC which measures just 4.3 cm, Shuttle is once again entering the world of AMD processors. The DA320 is a Barebone from the "XPC slim" family and also supports the latest AMD Ryzen CPUs in socket AM4 and up to 32 GB of RAM. Like all Shuttle products in a 1.3-litre format, this solution is also regarded as particularly robust. Opting for AMD processors means high computing power, especially when it comes to speeding up graphics. The accessories which are available separately and above all the price also make the DA320 a very attractive option.

Specifications:

Chassis
  • Slim PC with black chassis made of metal
  • Dimensions: 190 × 165 × 43 mm (LWH) = 1.35-litre
  • Weight: 1.13 kg net and 2.3 kg gross
  • Two holes for Kensington Locks and numerous
  • threaded holes (M3) on both sides of the chassis
Power Adapter
  • External 120 W power adapter (fanless)
  • Input: 100~240 V AC, 50/60 Hz
  • Output: 19 V DC, max. 6.32 A, max. 120 W
  • DC Connector: 5.5 / 2.5 mm (outer/inner diameter)
  • AC mains cable: 3 pins, ca. 1.8 m length, with C5/C6 coupler (called "Mickey Mouse" or "Clover-leaf") for the power adapter and CEE-7/7 plug with earth-contact (type E+F) for the power outlet
  • Dimensions: 150 × 65 × 36 mm (LWH)
Operating System
  • This system comes without an operating system.
  • It is compatible with Windows 10 and Linux (64-bit)
Processor support
  • Processor Socket AM4
  • Supports AMD Ryzen 2000/3000 series R5/R3 APUs
  • Supports AMD Athlon 2000 series APUs
  • Supports processors with integrated graphics only
  • Maximum supported processor power consumption (TDP) = 65 W
Processor cooling
  • Heat pipe processor cooling with two 60 mm fans on the upper side of the chassis
Mainboard / Chipset
  • Mainboard in a Shuttle form factor proprietary design for the XPC DA320
  • Chipset: AMD A320
BIOS
  • AMI BIOS, SPI Interface, 16 MB Flash-EEPROM
  • Supports Hardware Monitoring and Watchdog functionality
  • Supports Firmware-TPM (fTPM) v2.0
  • Supports boot up from external USB flash memory
  • Supports Unified Extensible Firmware Interface (UEFI)
  • Supports power on after power failure
Memory support
  • 2× SO-DIMM slot with 260 pins
  • Supports DDR4-2666/2933 (PC4-21300/23466) SDRAM at 1.2 V
  • Supports Dual Channel mode
  • Supports a maximum of 16 GB per DIMM,
  • maximum total size: 32 GB
  • Supports two unbuffered DIMM modules (no ECC or registered)
    *Note: The memory clock speed depends on the processor model. AMD Ryzen APUs support DDR4-2933 memory speed, while the AMD Athlon APUs support DDR4-2666.
Integrated Graphics
  • The features of the integrated Radeon™ Vega graphics function depend on the processor type used.
  • The PC features three digital video outputs which support 1080p/60 and 2160p/60:
    • 1× HDMI v2.0
    • 2× DisplayPort v1.2
  • Supports displays with 4K Ultra HD resolution at 3840 × 2160
  • Supports three independent displays with the integrated graphics function
  • Supports Blu-ray (BD) playback with HDCP content protection
  • DisplayPort and HDMI support multi-channel digital audio over the same cable.
  • Optional analog D-Sub/VGA video output
Drive bay
  • 1× 6.35 cm / 2.5" storage bay supports one hard disk or SSD drive with SATA connector
  • Device height: 12.5 mm (max.)
SATA connectors
  • 1× Serial-ATA III, 6 Gb/s (600 MB/s) bandwidth
  • With Serial-ATA power connector (onboard)
M.2-2280M SSD slot
  • The M.2-2280M slot provides the following interfaces:
    • PCI-Express Gen. 3 X4, supports NVMe
    • SATA v3.0 (max. 6 Gbps)
  • It supports M.2 cards with a width of 22 mm
  • and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
  • Supports the following M.2 SSDs: type SATA with B+M key and type PCI-Express/NVMe with M key.
M.2-2230E slot for WLAN cards
  • Interfaces: PCI-Express Gen. 3.0 X1 und USB 2.0
  • Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
  • Supports WLAN expansion cards (optional Shuttle accessory: WLN-M)
Audio
  • Audio Realtek® ALC 662 5.1 channel High-Definition Audio
  • Two analog audio connectors (3.5mm) on the front panel:
    • 2-channel line-out (head-phones)
    • microphone input
  • Digital multi-channel audio output: by HDMI and DisplayPort
Dual Gigabit LAN Controller
  • Dual network with two RJ45 ports with two status LEDs each
  • Used network chips:
    • 2× Realtek RTL8111H Ethernet Controller (MAC, PHY)
    • PCIe interface
  • Supports 10 / 100 / 1.000 MBit/s operation
  • Supports WAKE ON LAN (WOL)
  • Supports network boot by Preboot eXecution Environment (PXE)
  • Supports Teaming mode
Card Reader
  • Integrated card reader
  • Supports SD, SDHC and SDXC up to v3.01 memory flash cards
  • UHS-I interface supports up to 104 MB/s (SDR104) transfer speed
  • Realtek RTS5227S chip with PCIe chipset interface
  • Supports boot up from SD card.
Front Panel connectors
  • Microphone input
  • Audio Line-out (headphones)
  • 4× USB 3.2 Gen 1 (max. 5 Gbps)
  • SD card reader
  • Power button
  • Power LED (blue)
  • HDD LED (yellow)
Back Panel connectors
  • 1× HDMI 2.0 connector
  • 2× DisplayPort 1.2 connector (DP)
    Optional: 1× D-Sub VGA connector (Accessory PVG01)
  • 2× USB 3.2 Gen 1 (max. 5 Gbps)
  • 2× USB 2.0
  • 2× Gigabit LAN (RJ45)
  • 2× RS232 serial COM port, 9-pin D-Sub
  • 1× DC-input connector for external power adapter
  • 1× 4-pin connector (2.54 mm pitch) supports:
    • external power on button
    • Clear CMOS function
    • +5V DC voltage for external components
  • 2× perforation for optional Wireless LAN antennas
  • 2× hole for Kensington Lock
Other onboard connectors
  • 1× jumper for power-on-after-power-fail (hardware solution)
  • 1× analog VGA graphics output CN3 (2× 10-pin, 1 mm pitch)
  • 2× serial interface (COM) occupied by back panel connectors
  • 1× USB 2.0 (4-pin) for optional accessory WWN03 (LTE kit)
  • 1× fan connector (4-pin) occupied by the cooling system
  • 1× Debug header (reserved)
Supplied Accessories
  • Multi-language user guide (EN, DE, FR, ES, JP, KR, SC, TC)
  • VESA mount for 75/100 mm standard (two metal brackets)
  • Four screws M3 × 5 mm (screws together VESA mount and PC)
  • Four screws M4 × 10 mm (to affix VESA mount on the PC)
  • Four screws M3 × 4 mm (to mount a 2.5" storage device into the bay)
  • Two screws M3 × 5 mm (silver colour, to mount two M.2 cards)
  • Driver DVD (Windows 64-bit)
  • Serial ATA cable for 2.5" drive including power cable
  • External 120 W power adapter with power cord
  • Protection cap for CPU socket (do not use if heatpipe or fan is mounted)
  • Heatsink compound
Optional Accessories:
  • - PVG01: optional D-Sub VGA video output
  • - WLN-M. WLAN module in M.2-2230 format supports IEEE 802.11ac and Bluetooth 4.0 with two external antennas.
  • - WWN03: LTE adapter kit with antennas, but without LTE card
  • - PS02: Stand for vertical operation
  • - CXP01: adapter cable for an external power button
  • - PRM01: 2U rack mount front plate for two Shuttle XPC slim PCs
  • - DIR01: DIN-Rail mounting kit
Environmental Specifications
  • Operating temperature range: 0~50 °C
  • Relative humidity, non-condensing: 10~90 %
Certifications / Compliance:
  • EMI: FCC, CE, BSMI, RCM, VCCI
  • Safety: ETL, CB, BSMI
  • Other: RoHS, Energy Star, ErP
Conformity
  • This device is classed as technical information equipment (ITE) in class B and is intended for use in the living room and office. The CE-mark approves the conformity by the EU directives:
    • (1) 2004/108/EC relating to electromagnetic compatibility (EMC),
    • (2) 2006/95/EC relating to Electrical Equipment designed for use within certain voltage limits (LVD),
    • (3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)

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